EN 61188-5-3:2007

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 TSOP (Type 1)
  4.1 Field of application
  4.2 Component description
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 TSOP (Type 2)
  5.1 Field of application
  5.2 Component description
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
6 SOP
  6.1 Field of application
  6.2 Component description
  6.3 Component dimensions
  6.4 Solder joint fillet design
  6.5 Land pattern dimensions
7 SSOP
  7.1 Field of application
  7.2 Component description
  7.3 Component dimensions
  7.4 Solder joint fillet design
  7.5 Land pattern dimensions
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.