EN 61188-5-6:2003
Current
The latest, up-to-date edition.
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
04-04-2003
INTRODUCTION
1 Scope and object
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 QFJ (square)
4.1 Introductory remark
4.2 Component description
4.3 Component dimensions
4.4 Solder joint fillet design
4.5 Land pattern dimensions
5 QFJ (rectangular)
5.1 Introductory remark
5.2 Component description
5.3 Component dimensions
5.4 Solder joint fillet design
5.5 Land pattern dimensions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Figures
Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.
| Committee |
CLC/SR 91
|
| DevelopmentNote |
To be read in conjunction with EN 61188-5-1 (05/2003)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61188-5-6 : 2003 | Identical |
| BS EN 61188-5-6:2003 | Identical |
| NBN EN 61188 5-6 : 2004 | Identical |
| CEI EN 61188-5-6 : 2004 | Identical |
| PN EN 61188-5-6 : 2003 | Identical |
| NEN EN IEC 61188-5-6 : 2003 | Identical |
| DIN EN 61188-5-6:2003-10 | Identical |
| IEC 61188-5-6:2003 | Identical |
| UNE-EN 61188-5-6:2003 | Identical |
| I.S. EN 61188-5-6:2003 | Identical |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| EN 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IPC SM 782 : A1993 AMD 2 1999 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.