EN 61249-3-4:1999
Current
The latest, up-to-date edition.
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
15-04-1999
FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Designation
6 Properties of adhesive coated polyimide films
7 Dimensions and tolerances
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
reference numbers
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Gives requirements for flexible polyimide films coated on one side or both sides with acrylic or epoxide type adhesive for use in the fabrication of flexible printed wiring. Films coated on only one side are used as a coverlay or covercoat in the fabrication of flexible printed wiring. This coverlay or covercoat is also used to provide local support to areas subjected to mechanical or environmental stress. Films coated on both sides are used as bonding films in the fabrication of printed boards.
| Committee |
CLC/SR 91
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61249-3-4 : 2002 | Identical |
| NBN EN 61249 3-4 : 2000 | Identical |
| PN EN 61249-3-4 : 2002 | Identical |
| UNE-EN 61249-3-4:2000 | Identical |
| IEC 61249-3-4:1999 | Identical |
| BS EN 61249-3-4:1999 | Identical |
| I.S. EN 61249-3-4:1999 | Identical |
| SN EN 61249-3-4 : 1999 | Identical |
| DIN EN 61249-3-4:1999-11 | Identical |
| NEN EN IEC 61249-3-4 : 1999 | Identical |
| BS EN 60079-29-2:2007 | Identical |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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