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  • IEC 61189-2:2006

    Current The latest, up-to-date edition.

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English

    Published date:  30-05-2006

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Accuracy, precision and resolution
       3.1 Accuracy
       3.2 Precision
       3.3 Resolution
       3.4 Report
       3.5 Student's 't' distribution
       3.6 Suggested uncertainty limits
    4 Catalogue of approved test methods
    5 P: Preparation/conditioning test methods
       5.1 Test 2P01: Dry heat (under consideration)
       5.2 Test 2P02: Solder float stress (under consideration)
    6 V: Visual test methods
    7 D: Dimensional test methods
       7.1 Test 2D01: Thickness of base materials and rigid
             boards
    8 C: Chemical test methods
       8.1 Test 2C01: Resistance to sodium hydroxide of base
             materials
       8.2 Test 2C02: Gel time of epoxy based prepreg materials
       8.3 Test 2C03: Resin content of prepreg materials by
             treated weight
       8.4 Test 2C04: Volatile content of prepreg materials
       8.5 Test 2C05: Blistering during heat shock
       8.6 Test 2C06: Flammability, vertical burning test
             for rigid materials
       8.7 Test 2C07: Flammability; horizontal burning test
             for rigid materials
       8.8 Test 2C08: Flammability, flex material
       8.9 Test 2C09: Melting viscosity of prepreg materials
       8.10 Test 2C10: Resin content of prepreg materials by
             sublimation
       8.11 Test 2C11: UV blocking characteristics of laminates
       8.12 Test 2C12: Total halogen content in base materials
    9 M: Mechanical test methods
       9.1 Test 2M01: Test method for bow and twist
       9.2 Test 2M02: Bow/twist after etching and heating
       9.3 Test 2M03: Cure factor of base materials by
             differential scanning calorimetry (DSC) or
             thermomechanical analysis (TMA)
       9.4 Test 2M04: Twist after heating (under consideration)
       9.5 Test 2M05: Pull-off strength
       9.6 Test 2M06: Peel strength after exposure to solvent
             vapour
       9.7 Test 2M07: Peel strength after immersion in solvent
       9.8 Test 2M08: Flexural strength (under consideration)
       9.9 Test 2M09: Resin flow of prepreg material
       9.10 Test 2M10: Glass transition temperature of base
             materials by differential scanning calorimetry (DSC)
       9.11 Test 2M11: Glass transition temperature of base
             materials by thermomechanical analysis (TMA)
       9.12 Test 2M12: Surface waviness
       9.13 Test 2M13: Peel strength as received
       9.14 Test 2M14: Peel strength after heat shock
       9.15 Test 2M15: Peel strength after dry heat
       9.16 Test 2M16: Peel strength after simulated plating
       9.17 Test 2M17: Peel strength at high temperature
       9.18 Test 2M18: Surface quality (under consideration)
       9.19 Test 2M19: Punching (under consideration)
       9.20 Test 2M20: Flexural strength
       9.21 Test 2M21: Rolling fatigue of flexible base materials
       9.22 Test 2M22: Weight of foil after lamination
       9.23 Test method 2M23: Rectangularity of cut panels
       9.24 Test 2M24: Coefficient of thermal expansion (under
             consideration)
       9.25 Test 2M25: Time to delamination by thermomechanical
             analysis (TMA)
       9.26 Test 2M26: Scaled flow test for prepreg materials
       9.27 Test 2M27: The resin flow properties of coverlay
             films, bonding films and adhesive cast films used
             in the fabrication of flexible printed boards
    10 Electrical test methods
       10.1 Test 2E01: Surface tracking, moisture condition
             (under consideration)
       10.2 Test 10.2 2E02: Dielectric breakdown of base
             materials parallel to laminations
       10.3 Test 2E03: Surface resistance after damp heat,
             steady state
       10.4 Test 2E04: Volume resistivity and surface resistivity
       10.5 Test 2E05: Permittivity and dielectric dissipation
             (under consideration)
       10.6 Test 2E06: Volume and surface resistivity, 3
             electrodes (under consideration)
       10.7 Test 2E07: Surface and volume resistivity, elevated
             temperature (under consideration)
       10.8 Test 2E08: Surface corrosion
       10.9 Test 2E09: Comparative tracking index (CTI)
       10.10 Test 2E10: Permittivity and dissipation factor
             (under consideration)
       10.11 Test 2E11: Electric strength (under consideration)
       10.12 Test 2E12: Resistance of foil (under consideration)
       10.13 Test 2E13: Corrosion at edge (under consideration)
       10.14 Test 2E14: Arc resistance
       10.15 Test 2E15: Dielectric break-down (under consideration)
       10.16 Test 2E16: Contact resistance of printed circuit
             keypad cont (under consideration)
       10.17 Test 2E17: Insulation resistance of printed board
             materials
       10.18 Test 2E18: Fungus resistance of printed board
             materials
    11 N: Environmental test methods
       11.1 Test 2N01: Pressure cooker test (under consideration)
       11.2 Test 2N02: Water absorption
    12 X: Miscellaneous test methods
       12.1 Test 2X02: Dimensional stability of thin laminates
    Annex A (informative) Worked examples
    Annex B (informative) Conversion table
    Annex C (informative) Laboratory pro forma (form)
    Annex D (informative) Laboratory pro forma

    Abstract - (Show below) - (Hide below)

    Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Supersedes IEC 60249-1. (03/2008) Stability Date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    NF EN 61249-2-27 : 2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-27: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BISMALEIMIDE/TRIAZINE MODIFIED WITH NON-HALOGENATED EPOXIDE WOVEN GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61249-2-39:2013 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    07/30174325 DC : 0 BS EN 61249-2-41 - MATERIALS FOR PRINTED CIRCUIT BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EXPOIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS IEC 61189-5-4 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
    NF EN 61249-2-43 : 2016 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    09/30211071 DC : 0 BS EN 61249-2-30 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXCIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINMATE OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61249-2-23:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-23: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED PHENOLIC CELLULOSE PAPER REINFORCED LAMINATED SHEETS, ECONOMIC GRADE, COPPER-CLAD
    NF EN 61347-1 : 2015 LAMP CONTROLGEAR - PART 1: GENERAL AND SAFETY REQUIREMENTS
    BS EN 61249-2-26:2005 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    02/211157 DC : DRAFT DEC 2002 IEC 61249-4-12 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
    07/30164989 DC : 0 EN 61249-2-36 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-36: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    07/30164973 DC : 0 EN 61249-2-31 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-31: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 4.1 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    07/30164993 DC : 0 EN 61249-2-37 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    03/107475 DC : 0 IEC 61249-6-3 ED.1.0 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 6-3: SECTIONAL SPECIFICATION FOR REINFORCEMENTS - WOVEN FIBREGLASS FABRICS
    NF EN 61249-2-38 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61249-2-18:2002 MATERIALS FOR INTERCONNECTION STRUCTURES - SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYESTER NON-WOVEN FIBREGLASS REINFORCED LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER CLAD
    CEI EN 61249-2-39 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-39: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE EPOXIDE AND NON-EPOXIDE, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-2-18 : 2002 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-18: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYESTER NON-WOVEN FIBREGLASS REINFORCED LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    BS EN 61249-2-43:2016 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    07/30164985 DC : 0 BS EN 61249-2-34 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-34: REINFORCED BASE MATERIALS CLAD AND UNCLAD FOR HIGH FREQUENCY APPLICATION - NON-HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATED SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL OR LESS THEN 3.7 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61249-2-4:2002 Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
    CEI EN 61249-2-2 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-2: REINFORCED BASE MATERIALS, CLAD AND UNCLAD PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEETS, HIGH ELECTRICAL GRADE, COPPER-CLAD
    CEI EN 62496-2-2 : 2012 OPTICAL CIRCUIT BOARDS - PART 2-2: MEASUREMENTS - DIMENSIONS OF OPTICAL CIRCUIT BOARDS
    02/206695 DC : DRAFT JUN 2002 IEC 61249-2-1. ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES - PART 2-1: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEET, ECONOMIC GRADE, COPPER CLAD
    CEI EN 61249-2-5 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 2-5: REINFORCED BASE MATERIALS, CLAD AND UNCLAD BROMINATED EPOXIDE CELLULOSE PAPER REINFORCED CORE / WOVEN E-GLASS REINFORCED SURFACES LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    BS EN 61249-2-2:2005 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
    BS EN 61249-2-8:2003 Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    CEI EN 50557 : 2012 REQUIREMENTS FOR AUTOMATIC RECLOSING DEVICES (ARDS) FOR CIRCUIT BREAKERS-RCBOS-RCCBS FOR HOUSEHOLD AND SIMILAR USES
    BS EN 61190-1-1:2002 Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 61249-2-18:2002 Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
    IEC 61249-2-10:2003 Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    CEI EN 61249-4-11 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 61249-2-22:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
    I.S. EN 61347-1:2015 LAMP CONTROLGEAR - PART 1: GENERAL AND SAFETY REQUIREMENTS
    CEI EN 61249-2-40 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, MODIFIED, NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-4-18:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-2-2:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-2: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEETS, HIGH ELECTRICAL GRADE, COPPER-CLAD
    CEI EN 61249-4-12 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    CEI EN 61249-2-11 : 2005 MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-11: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES RENFORCEES EN POLYIMIDE ET TISSU DE VERRE DE TYPE E EPOXYDE BROME MODIFIE OU NON MODIFIE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE), PLAQUEES CUIVRE
    I.S. EN 61249-2-44:2016 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-44: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-4-15:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    NF EN 61249-4-14 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-2-30:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINATE OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD (IEC 61249-2-30:2012 (EQV))
    IEC PAS 63015:2016 Definition of "Low-Halogen" for electronic products
    I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
    IEC 61249-2-1:2005 Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
    BS EN 61347-1:2015 Lamp controlgear General and safety requirements
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    EN 61347-1:2015 Lamp controlgear - Part 1: General and safety requirements
    EN 61249-4-5:2005 Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
    EN 61249-2-37:2009 Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 61249-2-43:2016 Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 61249-8-7:1996 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
    EN 61249-5-4:1996 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
    EN 61249-2-13:1999 Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper clad
    EN 61249-4-19:2013 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    EN 61249-4-15 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    EN 61249-4-2:2005 Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
    EN 61249-2-1:2005 Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
    EN 62496-2-2:2011 Optical circuit boards - Part 2-2: Measurements - Dimensions of optical circuit boards
    EN 61249-2-27:2013 Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
    EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    EN 61249-2-26:2005 Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
    EN 61249-2-44:2016 Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    EN 61249-2-18:2002 Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
    EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    EN 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
    EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    NF EN 61249-4-16 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-2-37 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-37: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 61249-2-1:2005 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
    02/210157 DC : DRAFT OCT 2002 IEC 61249-2-23 ED.1 - MATERIALS FOR INTERCONNECTION STRUCTURES - PART 2-23: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - SECTION 23: NON-HALOGENATED PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE SHEET, ECONOMIC GRADE, COPPER CLAD
    BS EN 61249-2-6:2003 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    CEI EN 61249-4-16 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 61249-2-42:2010 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    BS EN 61249-4-12:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
    BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
    BS EN 61249-4-5:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability
    01/205138 DC : 0 IEC 61249-4-1 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - SECTION 1: EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    BS IEC 61189-5-3 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
    I.S. EN 61249-2-43:2016 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-43: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    NF EN 61249-2-40 : 2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-40: REINFORCED BASE MATERIALS CLAD AND UNCLAD - HIGH PERFORMANCE, MODIFIED, NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    BS EN 61249-2-10:2003 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-10: REINFORCED BASE MATERIALS CLAD AND UNCLAD - CYANATE ESTER, BROMINATED EPOXIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    DIN EN 61249-3-3:1999-11 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-3: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS); ADHESIVE COATED FLEXIBLE POLYESTER FILM
    NF EN 61249-2-41 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    02/207116 DC : DRAFT JUN 2002 IEC 61249-2-2. ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES - PART 2-2: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - PHENOLIC CELLULOSE PAPER REINFORCED LAMINATE, HIGH ELECTRICAL GRADE, COPPER CLAD
    BS EN 61249-2-30:2013 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
    BS EN 61249-2-40:2013 Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    BS EN 61249-2-21:2003 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    BS EN 61249-2-37:2009 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    CEI EN 61249-2-23 : 2005 MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-23: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES RENFORCEES DE PAPIER CELLULOSE PHENOLIQUE NON HALOGENE, DE QUALITE ECONOMIQUE, PLAQUEES CUIVRE
    BS EN 61249-8-7:1997 MATERIALS FOR INTERCONNECTION STRUCTURES - SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - MARKING LEGEND INKS
    BS EN 61249-2-9:2003 Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
    BS EN 61249-2-5:2003 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-5: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER REINFORCED CORE/WOVEN E-GLASS REINFORCED SURFACES LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    CEI EN 61249-4-2 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-2: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 61249-2-4:2002 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-4: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYESTER NON-WOVEN/WOVEN FIBREGLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    I.S. EN 61249-2-8:2003 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-8: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED BROMINATED EPOXIDE WOVEN FIBREGLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    CEI EN 61249-2-30 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-30: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE MODIFIED CYANATE ESTER WOVEN GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    IEC 61249-2-40:2012 Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    CEI EN 61249-2-9 : 2004 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-9: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BISMALEIMIDE/TRIAZINE, MODIFIED EPOXIDE OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    CEI EN 61249-2-22 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    NF EN 61249 8-8 : 1998 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS
    I.S. EN 61249-2-36:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-36: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    NF EN 61249-2-42 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-42: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-2-35 : 2010 MATERIAUX POUR CIRCUITS IMPRIMES ET AUTRES STRUCTURES D'INTERCONNEXION - PARTIE 2-35: MATERIAUX DE BASE RENFORCES, PLAQUES ET NON PLAQUES - FEUILLES STRATIFIEES EN TISSU DE VERRE DE TYPE E EPOXYDE MODIFIE, PLAQUEES CUIVRE, D'INFLAMMABILITE DEFINIE (ESSAI DE COMBUSTION VERTICALE) POUR LES ASSEMBLAGES SANS PLOMB
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    I.S. EN 61249-4-12:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    CEI EN 61249-2-41 : 2011 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-41: REINFORCED BASE MATERIALS CLAD AND UNCLAD - BROMINATED EPOXIDE CELLULOSE PAPER/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61193-3:2013 QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV))
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    I.S. EN 61249-2-9:2003 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    I.S. EN 61249-5-4:1999 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS - SECTION 4: CONDUCTIVE INKS
    I.S. EN 61249-2-35:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-2-38:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-38: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    I.S. EN 63024:2018