EN 62047-22:2014

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions, symbols
  and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC 62047-22:2014 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.