EN IEC 61188-6-1:2021
Current
Current
The latest, up-to-date edition.
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
Published date
02-04-2021
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IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
| Committee |
CLC/SR 91
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61188-6-1:2021 | Identical |
| BS EN IEC 61188-6-1:2021 | Equivalent |
| CEI EN IEC 61188-6-1:2021-11 | Identical |
| NF EN IEC 61188-6-1:2021 | Identical |
| OVE EN IEC 61188-6-1:2022 10 01 | Identical |
| I.S. EN IEC 61188-6-1:2021 | Identical |
| PN-EN IEC 61188-6-1:2021-11 | Identical |
| UNE-EN IEC 61188-6-1:2021 | Identical |
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