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Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
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Published date: 12-03-2021
Publisher: European Committee for Standards - Electrical
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
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