NEN-EN-IEC 61760-3:2021
Current
Current
The latest, up-to-date edition.
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Available format(s)
Hardcopy
Language(s)
English - French
Published date
01-04-2021
Publisher
NEN-EN-IEC 61760-3 gives a reference set of requirements, process conditions and relatedtest conditions to be used when compiling specifications of electronic components that areintended for usage in through-hole reflow soldering technology.
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