NEN-EN-IEC 61760-3:2021
Current
Current
The latest, up-to-date edition.
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Published date
01-04-2021
Publisher
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NEN-EN-IEC 61760-3 gives a reference set of requirements, process conditions and relatedtest conditions to be used when compiling specifications of electronic components that areintended for usage in through-hole reflow soldering technology.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61760-3:2021 | Identical |
| EN IEC 61760-3:2021 | Identical |
Summarise
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