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CEN
EN ISO 9455-14:2017

EN ISO 9455-14:2017

Current

Current

The latest, up-to-date edition.

Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)

Published date

20-09-2017

Publisher

Comite Europeen de Normalisation

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European foreword
Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Principle
5 Reagents and materials
6 Apparatus
7 Test pieces
8 Procedure
9 Examination of the test piece
10 Expression of results
11 Test report

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

Committee
CEN/TC 121
DevelopmentNote
Supersedes EN 29455-14. (10/2017)
DocumentType
Standard
PublisherName
Comite Europeen de Normalisation
Status
Current
Supersedes

ISO 197-1:1983 Copper and copper alloys — Terms and definitions — Part 1: Materials
ISO 9455-2:1993 Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method
ISO 9455-1:1990 Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
ISO 9453:2014 Soft solder alloys Chemical compositions and forms

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