EN ISO 9455-17:2006
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)
21-06-2006
31-12-2006
Foreword
1 Scope
2 Normative references
3 Principle
4 Reagents
5 Apparatus
6 Inspection of test coupons
7 Sample preparation
8 Procedure
9 Assessment
10 Precision
11 Test report
Annex A (informative) SIR testing guidance
Annex B (informative) Surface insulation resistance comb
test and electrochemical migration test of flux
residues - Qualification test report
Bibliography
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
| Committee |
CEN/TC 121
|
| DocumentType |
Standard
|
| PublisherName |
Comite Europeen de Normalisation
|
| Status |
Withdrawn
|
| Standards | Relationship |
| BS EN ISO 9455-17:2006 | Identical |
| PN EN ISO 9455-17 : 2006 | Identical |
| NBN EN ISO 9455-17 : 2006 | Identical |
| NF EN ISO 9455-17 : 2006 | Identical |
| NS EN ISO 9455-17 : 1ED 2006 | Identical |
| DIN EN ISO 9455-17:2006-09 | Identical |
| NEN EN ISO 9455-17 : 2006 | Identical |
| I.S. EN ISO 9455-17:2006 | Identical |
| ISO 9455-17:2002 | Identical |
| DS EN ISO 9455-17 : 2006 | Identical |
| UNE-EN ISO 9455-17:2007 | Identical |