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  • ISO 9455-17:2002

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  10-01-2024

    Language(s):  English, French

    Published date:  09-12-2002

    Publisher:  International Organization for Standardization

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    Abstract - (Show below) - (Hide below)

    ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.

    This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

    General Product Information - (Show below) - (Hide below)

    Committee ISO/TC 44/SC 12
    Development Note Supersedes ISO/DIS 9455-17 (12/2002)
    Document Type Standard
    Publisher International Organization for Standardization
    Status Superseded
    Superseded By
    Under Revision

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN ISO 12224-1:1998 Solder wire, solid and flux cored. Specification and test methods Classification and performance requirements
    IPC J STD 004 RUSSIAN : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC J STD 004 CHINESE : B REQUIREMENTS FOR SOLDERING FLUXES
    I.S. EN ISO 9454-2:2000 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS
    IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
    12/30254694 DC : DRAFT MAR 2012 BS ISO 16525-8 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 8: ELECTROCHEMICAL-MIGRATION TEST METHODS
    PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
    NF EN ISO 9454-2 : 2000 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS
    EN ISO 12224-1:1998 Solder wire, solid and flux cored - Specification and test methods - Part 1: Classification and performance requirements (ISO 12224-1:1997)
    IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    BS ISO 16525-8:2014 Adhesives. Test methods for isotropic electrically conductive adhesives Electrochemical-migration test methods
    ISO 16525-8:2014 Adhesives Test methods for isotropic electrically conductive adhesives Part 8: Electrochemical-migration test methods

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
    IPC TM 650 : 0 TEST METHODS MANUAL
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    ISO 5725-2:1994 Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
    ISO 12224-1:1997 Solder wire, solid and flux cored Specification and test methods Part 1: Classification and performance requirements
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