ISO 9455-17:2002
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
Hardcopy , PDF
English, French
09-12-2002
09-04-2025
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
| Committee |
ISO/TC 44/SC 12
|
| DevelopmentNote |
Supersedes ISO/DIS 9455-17 (12/2002)
|
| DocumentType |
Standard
|
| Pages |
21
|
| PublisherName |
International Organization for Standardization
|
| Status |
Withdrawn
|
| SupersededBy | |
| UnderRevision |
| Standards | Relationship |
| NBN EN ISO 9455-17 : 2006 | Identical |
| NEN EN ISO 9455-17 : 2006 | Identical |
| NS EN ISO 9455-17 : 1ED 2006 | Identical |
| I.S. EN ISO 9455-17:2006 | Identical |
| PN EN ISO 9455-17 : 2006 | Identical |
| BS ISO 9455-17 : 2002 AMD 16425 | Identical |
| BS EN ISO 9455-17:2006 | Identical |
| EN ISO 9455-17:2006 | Identical |
| NF EN ISO 9455-17 : 2006 | Identical |
| DIN EN ISO 9455-17:2006-09 | Identical |
| DS EN ISO 9455-17 : 2006 | Identical |
| UNE-EN ISO 9455-17:2007 | Identical |
A newer version of this standard is available.
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