I.S. EN 120000:1998

PART 1: Semiconductor optoelectronic and liquid devices
SECTION 1 - SCOPE
SECTION 2 - GENERAL
2.1 Order of precedent
2.2 Related documents
2.3 Units, symbols and terminology
2.4 Preferred values of ratings and characteristics
2.5 Marking
2.6 Ordering information
SECTION 3 - QUALITY ASSESSMENT PROCEDURES
3.1 Primary stage of manufacture and subcontracting
3.2 Definition of a production lot
3.3 Structurally similar devices
3.4 Qualification approval procedure
3.5 Quality conformance inspection
3.6 Levels of quality assessment - General inspection
      requirements for semiconductor optoelectronic
      devices
SECTION 4 - TEST AND MEASUREMENT CONDITIONS
4.1 Standard conditions for testing
4.2 Visual examination
4.3 Electrical and optical measurements
4.4 Climatic and mechanical tests
4.5 Electrical endurance tests
SECTION 5 - LASER MODULE RELIABILITY
5.1 Scope
5.2 Terms and definitions
5.3 Introduction
5.4 Reliability requirements
5.5 Guidance
5.6 Laser diode and laser module failure mechanisms
Figures
1 Example of structural similarity for phototransistor
    and photocopier
2 Screening procedures - flow diagram
3 Optical port - pigtailed devices - emitter or detector
4 Optical port - packaged devices - emitter or detector
    without pigtail
5 Optical port - non-packaged devices - emitter or
    detector without pigtail
6 Orientation of a device to direction of applied force
7 Orientation of a flat package with radial leads from
    one side only to direction of applied force
8 Orientation of a cylindrical device to direction of
    applied force
9 Non-linearities in laser light-current characteristics
10 A "bathtub" failure rate curve
11 Example of cumulative failure plot showing log-normal
    distribution of laser failure rate
12 Calculated failure rates for components having a
    lognormal lifetime distribution, with a median life
    of 10/6 hours and dispersion in the range 0,5 to 2,0
13 Cross section through a typical laser module showing
    key components
14 Cross section through a typical buried-heterostructure
    laser (bonded junction-side-up)
PART 2: Visual inspection of LCD and rejection criteria
1 General
2 Visual inspection of viewing area
3 Seal inspection
4 Visual inspection of contact surface
5 Visual inspection for chipped material at the corners
    and edges of the glass plates
6 Visual inspection of the display
Figures
1 Defects within the viewing range
2 Defects within the sealing area
3 Defects of contact pad area
4 Damage of a corner and of an edge
5 Deviations of dimensions and shape e1...e4: deviations
6 Defects within segments
PART 3: Visual inspection requirements for opto-electrical
semiconductor devices
Section 1 - General
1.1 Purpose
1.2 Scope
1.3 Special considerations
1.4 Precedence, related documents, units and symbols
1.5 Terminology - Terms and definitions
1.6 Visual assessment
1,7 Controlled environment
Section 2 - Visual inspection requirements for dies
2.1 General
2.2 Metallisation defects (critical area)
2.3 Metallisation defects (non-critical area)
2.4 Diffusion, passivation and dielectric isolation
      defects
2.5 Growth defects
2.6 Die defects
2.7 Foreign material
Section 3 - Visual inspection requirements for bonded die
3.1 General
3.2 Die mounting defects
3.3 Wire bonded defects
Section 4 - Visual inspection requirements for packaged
devices
4.1 Pre-encapsulation visual inspection at a
      magnification of x 10 to x 70
4.2 Post encapsulation visual inspection
4.3 Final external visual inspection
Figures (to Part 3)
1 Critical areas
2 Scratches and voids
3 Chip-outs and cracks
4 Die orientation defects
5 Mounting material defects
6 Wedge bonds (wire) defects
7 Side weld defect
PART 4: Capability approval
1 Introduction
2 Terminology
3 Procedure for granting the capability approval
4 Capability approval maintenance procedure
5 Procedure for reduction, extension or change of
    capability
6 Procedure in case of deficiency in maintenance of the
    capability approval
7 Capability manual
8 Capability test programme
9 Verification of capability (audit)
10 Quality assurance of products delivered under
    capability approval
11 Marking and ordering information
12 Capability abstract for publication purposes
13 Customer detail specifications
14 Standard catalogue items detail specifications
15 Detail specification register
16 Handling
17 Product safety
PART 5: Semiconductor laser diodes, laser diode modules
and laser diode assemblies of assessed quality -
Capability approval
1 General
1.1 Scope
1.2 Related documents
1.3 Units, symbols and terminology
1.4 Standard and preferred values
1.5 Marking of component and package
2 Quality assessment procedures
2.1 General
2.2 Procedures for capability approval
2.3 Procedures following the granting of capability
     approval
2.4 Release for delivery
3 Test and measurement procedures
3.1 Test and measurement conditions
3.2 Visual inspection
3.3 Dimensioning and gauging procedures
3.4 Electrical test procedures
3.5 Mechanical test procedures
3.6 Environmental test procedures
3.7 Endurance test procedures
Figures
1 Optical port- pigtailed devices - emitter or detector
     with bare fibre pigtail
2 Optical port - pigtailed devices - emitter or
     detector with fibre pigtail with connector attached
3 Optical port - packaged devices - emitter or detector
     without pigtail, with window but without lens
4 Optical port - packaged devices - emitter or detector
     without pigtail, with window, but without lens(chip
     reference)
5 Optical port - packaged devices - emitter or detector
     without pigtail, with lens
6 Optical port - non-packaged devices - emitter or
     detector without pigtail
7 Threshold current of a laser diode
8 Spectral characteristics of laser diodes and
     laserdiode modules
9 Radiation diagram and related characteristics
10 Laser diode, laser module/assembly - flow chart
11 Typical equipment layout

Details quality assessment and test and measurement procedures for image converter and image intensifier tubes intended for use in the CECC System of harmonised specifications.