• I.S. EN 120000:1998

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.


    Available format(s): 

    Withdrawn date:  19-05-2000


    Published date:  27-11-1998

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    PART 1: Semiconductor optoelectronic and liquid devices
    2.1 Order of precedent
    2.2 Related documents
    2.3 Units, symbols and terminology
    2.4 Preferred values of ratings and characteristics
    2.5 Marking
    2.6 Ordering information
    3.1 Primary stage of manufacture and subcontracting
    3.2 Definition of a production lot
    3.3 Structurally similar devices
    3.4 Qualification approval procedure
    3.5 Quality conformance inspection
    3.6 Levels of quality assessment - General inspection
          requirements for semiconductor optoelectronic
    4.1 Standard conditions for testing
    4.2 Visual examination
    4.3 Electrical and optical measurements
    4.4 Climatic and mechanical tests
    4.5 Electrical endurance tests
    5.1 Scope
    5.2 Terms and definitions
    5.3 Introduction
    5.4 Reliability requirements
    5.5 Guidance
    5.6 Laser diode and laser module failure mechanisms
    1 Example of structural similarity for phototransistor
        and photocopier
    2 Screening procedures - flow diagram
    3 Optical port - pigtailed devices - emitter or detector
    4 Optical port - packaged devices - emitter or detector
        without pigtail
    5 Optical port - non-packaged devices - emitter or
        detector without pigtail
    6 Orientation of a device to direction of applied force
    7 Orientation of a flat package with radial leads from
        one side only to direction of applied force
    8 Orientation of a cylindrical device to direction of
        applied force
    9 Non-linearities in laser light-current characteristics
    10 A "bathtub" failure rate curve
    11 Example of cumulative failure plot showing log-normal
        distribution of laser failure rate
    12 Calculated failure rates for components having a
        lognormal lifetime distribution, with a median life
        of 10/6 hours and dispersion in the range 0,5 to 2,0
    13 Cross section through a typical laser module showing
        key components
    14 Cross section through a typical buried-heterostructure
        laser (bonded junction-side-up)
    PART 2: Visual inspection of LCD and rejection criteria
    1 General
    2 Visual inspection of viewing area
    3 Seal inspection
    4 Visual inspection of contact surface
    5 Visual inspection for chipped material at the corners
        and edges of the glass plates
    6 Visual inspection of the display
    1 Defects within the viewing range
    2 Defects within the sealing area
    3 Defects of contact pad area
    4 Damage of a corner and of an edge
    5 Deviations of dimensions and shape e1...e4: deviations
    6 Defects within segments
    PART 3: Visual inspection requirements for opto-electrical
    semiconductor devices
    Section 1 - General
    1.1 Purpose
    1.2 Scope
    1.3 Special considerations
    1.4 Precedence, related documents, units and symbols
    1.5 Terminology - Terms and definitions
    1.6 Visual assessment
    1,7 Controlled environment
    Section 2 - Visual inspection requirements for dies
    2.1 General
    2.2 Metallisation defects (critical area)
    2.3 Metallisation defects (non-critical area)
    2.4 Diffusion, passivation and dielectric isolation
    2.5 Growth defects
    2.6 Die defects
    2.7 Foreign material
    Section 3 - Visual inspection requirements for bonded die
    3.1 General
    3.2 Die mounting defects
    3.3 Wire bonded defects
    Section 4 - Visual inspection requirements for packaged
    4.1 Pre-encapsulation visual inspection at a
          magnification of x 10 to x 70
    4.2 Post encapsulation visual inspection
    4.3 Final external visual inspection
    Figures (to Part 3)
    1 Critical areas
    2 Scratches and voids
    3 Chip-outs and cracks
    4 Die orientation defects
    5 Mounting material defects
    6 Wedge bonds (wire) defects
    7 Side weld defect
    PART 4: Capability approval
    1 Introduction
    2 Terminology
    3 Procedure for granting the capability approval
    4 Capability approval maintenance procedure
    5 Procedure for reduction, extension or change of
    6 Procedure in case of deficiency in maintenance of the
        capability approval
    7 Capability manual
    8 Capability test programme
    9 Verification of capability (audit)
    10 Quality assurance of products delivered under
        capability approval
    11 Marking and ordering information
    12 Capability abstract for publication purposes
    13 Customer detail specifications
    14 Standard catalogue items detail specifications
    15 Detail specification register
    16 Handling
    17 Product safety
    PART 5: Semiconductor laser diodes, laser diode modules
    and laser diode assemblies of assessed quality -
    Capability approval
    1 General
    1.1 Scope
    1.2 Related documents
    1.3 Units, symbols and terminology
    1.4 Standard and preferred values
    1.5 Marking of component and package
    2 Quality assessment procedures
    2.1 General
    2.2 Procedures for capability approval
    2.3 Procedures following the granting of capability
    2.4 Release for delivery
    3 Test and measurement procedures
    3.1 Test and measurement conditions
    3.2 Visual inspection
    3.3 Dimensioning and gauging procedures
    3.4 Electrical test procedures
    3.5 Mechanical test procedures
    3.6 Environmental test procedures
    3.7 Endurance test procedures
    1 Optical port- pigtailed devices - emitter or detector
         with bare fibre pigtail
    2 Optical port - pigtailed devices - emitter or
         detector with fibre pigtail with connector attached
    3 Optical port - packaged devices - emitter or detector
         without pigtail, with window but without lens
    4 Optical port - packaged devices - emitter or detector
         without pigtail, with window, but without lens(chip
    5 Optical port - packaged devices - emitter or detector
         without pigtail, with lens
    6 Optical port - non-packaged devices - emitter or
         detector without pigtail
    7 Threshold current of a laser diode
    8 Spectral characteristics of laser diodes and
         laserdiode modules
    9 Radiation diagram and related characteristics
    10 Laser diode, laser module/assembly - flow chart
    11 Typical equipment layout

    Abstract - (Show below) - (Hide below)

    Details quality assessment and test and measurement procedures for image converter and image intensifier tubes intended for use in the CECC System of harmonised specifications.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Withdrawn
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