I.S. EN 165000-2:1998
Current
The latest, up-to-date edition.
FILM AND HYBRID INTEGRATED CIRCUITS - PART 2: INTERNAL VISUAL INSPECTION AND SPECIAL TESTS
Hardcopy , PDF
English
01-01-1998
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
SECTION 1 INTERNAL VISUAL INSPECTION
1 General
1.1 Purpose
1.2 Sequence of inspection
1.3 Inspection apparatus
1.4 Inspection environment
1.5 Magnification
1.6 Definitions
1.7 Interpretation
1.8 Alternative test methods
2 Substrate and processes
2.1 Substrate
2.2 Processes
2.2.1 Conductors
2.2.2 Isolating layer
2.2.3 Resistors
2.2.4 Foreign material
3 Assembly - mechanical attachment and electrical
connection to parts of the substrate
3.1 Added components
3.2 Assembly method
3.2.1 General
3.2.2 Soldering and eutectic attachment
4 Assembly - mechanical attachment and electrical
connection of substrate to package
4.1 General
4.2 Soldering and organic adhesive
5 Wire interconnections
5.1 General
5.2 Gold ball and wedge bonds
5.3 Gold ball bonds
5.4 Tailless (crescent) bonds
5.5 Wedge bonds
5.6 Compound bonds
5.7 Beam lead bonds
5.8 Bonding wires
6 Foreign material
7 Selective organic protection
8 Figures
SECTION 2 RADIOGRAPHIC INSPECTION
1 General
2 Requirements
2.1 Views
2.2 Reports and records
2.3 Examination and acceptance criteria
SECTION 3 PARTICLE IMPACT NOISE DETECTION (PIND) TEST
1 Object
2 General
3 Equipment
4 Test procedure
5 Failure criteria
6 Lot acceptance
7 The detail specification
Important note : Users cannot be edited or removed once added to your Multi user PDF.Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.