Section 1. Internal visual inspection
1 General
1.1 Purpose
1.2 Sequence of inspection
1.3 Inspection apparatus
1.4 Inspection environment
1.5 Magnification
1.6 Definitions
1.7 Interpretation
1.8 Alternative test methods
2 Substrate and processes
2.1 Substrate
2.2 Processes
2.2.1 Conductors
2.2.2 Isolating layer
2.2.3 Resistors
2.2.4 Foreign material
3 Assembly - mechanical attachment and electrical
connection to parts of the substrate
3.1 Added components
3.2 Assembly method
3.2.1 General
3.2.2 Soldering and eutectic attachment
3.2.3 Organic adhesive
4 Assembly - mechanical attachment and electrical
connection of substrate to package
4.1 General
4.2 Soldering and organic adhesive
5 Wire interconnections
5.1 General
5.2 Gold ball and wedge bonds
5.3 Gold ball bonds
5.4 Tailless (crescent) bonds
5.5 Wedge bonds
5.6 Compound bonds
5.7 Beam lead bonds
5.8 Bonding wires
6 Foreign material
7 Selectived organic protection
8 Figures
Section 2. Radiographic inspection
1 General
2 Requirements
2.1 Views
2.2 Reports and records
2.3 Examination and acceptance criteria
Section 3. Particle impact noise detection (PIND) test
1 Object
2 General
3 Equipment
4 Test procedure
5 Failure criteria
6 Lot acceptance
7 The detail specification