I.S. EN 60191-4:2014
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 4: CODING SYSTEM AND CLASSIFICATION INTO FORMS OF PACKAGE OUTLINES FOR SEMICONDUCTOR DEVICE PACKAGES
Hardcopy , PDF
English
01-01-2014
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
NATIONAL FOREWORD
FOREWORD
1 Scope
2 Coding system of package outlines for
semiconductor devices
3 Classification into forms of package outlines
for semiconductor devices
4 Coding system for semiconductor-device packages
5 Coding system of package-outline styles
Annex A (informative) - Examples of descriptive
coding system application
Annex B (informative) - Derivation and application of
the descriptive coding system - Common
package names
Annex C (informative) - Terminology of
semiconductor package outlines
Defines a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.
DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
DocumentType |
Standard
|
Pages |
58
|
PublisherName |
National Standards Authority of Ireland
|
Status |
Current
|
Standards | Relationship |
SN EN 60191-4 : 1999 | Identical |
NF EN 60191-4 : 2014 | Identical |
NBN EN 60191-4 : 2014 | Identical |
DIN EN 60191-4:2014-10 | Identical |
BS EN 60191-4 : 2014 | Identical |
UNE-EN 60191-4:2001 | Identical |
IEC 60191-4:2013 | Identical |
EN 60191-4:2014/A1:2018 | Identical |
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