EN 60191-4:2014/A1:2018
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 4: CODING SYSTEM AND CLASSIFICATION INTO FORMS OF PACKAGE OUTLINES FOR SEMICONDUCTOR DEVICE PACKAGES (IEC 60191-4:2013/A1:2018)
18-05-2018
FOREWORD
1 Scope
2 Coding system of package outlines for semiconductor
devices
3 Classification into forms of package outlines for
semiconductor devices
4 Coding systems for semiconductor-device packages
5 Coding system of package-outline styles
Annex A (informative) - Examples of descriptive coding system
application
Annex B (informative) - Derivation and application of the
descriptive coding system - Common package names
Annex C (informative) - Terminology of
semiconductor package outlines
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