I.S. EN 60191-4:2014
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 4: CODING SYSTEM AND CLASSIFICATION INTO FORMS OF PACKAGE OUTLINES FOR SEMICONDUCTOR DEVICE PACKAGES
Hardcopy , PDF
English
01-01-2014
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
NATIONAL FOREWORD
FOREWORD
1 Scope
2 Coding system of package outlines for
semiconductor devices
3 Classification into forms of package outlines
for semiconductor devices
4 Coding system for semiconductor-device packages
5 Coding system of package-outline styles
Annex A (informative) - Examples of descriptive
coding system application
Annex B (informative) - Derivation and application of
the descriptive coding system - Common
package names
Annex C (informative) - Terminology of
semiconductor package outlines
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