I.S. EN 60191-6-6:2001
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE PITCH LAND GRID ARRAY (FLGA)
Hardcopy , PDF
English
01-01-2001
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Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
3.1 Flanged type
3.2 Type of real chip size
3.3 FLGA
3.4 Material designation
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Specifies common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0.80 mm and whose package body outline is square.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 60191-6-6:2002-02 | Identical |
| SN EN 60191-6-6 : 2001 | Identical |
| NF EN 60191-6-6 : 2002 | Identical |
| UNE-EN 60191-6-6:2002 | Identical |
| IEC 60191-6-6:2001 | Identical |
| EN 60191-6-6:2001 | Identical |
| BS EN 60191-6-6:2001 | Identical |
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