I.S. EN 60249-2-11:1995
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS
Hardcopy , PDF
09-06-2016
English
27-01-1995
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
PREFACE
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material after
complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other international publications quoted in
this standard with the references
of the relevant European publications
Provides requirements for properties of thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards.
| DocumentType |
Standard
|
| Pages |
78
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Withdrawn
|
| Standards | Relationship |
| EN 60249-2-11 : 1994 AMD 4 2000 | Identical |
| IEC 60249-2-11:1987 | Identical |
| BS EN 60249-2-11:1994 | Identical |
| SN EN 60249-2-11 : 1994 AMD 4 2000 | Identical |
| DIN EN 60249-2-11:2001-09 | Identical |
| UNE-EN 60249-2-11:1996 | Identical |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 60249-3-1:1981 | Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.