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    I.S. EN 60249-2-2:1994

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  09-06-2016

    Language(s):  English

    Published date:  27-01-1995

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    PREFACE
    1 Scope
    2 Materials and construction
    3 Internal marking
    4 Electrical properties
    5 Non-electrical properties of the copper-clad film
    6 Non-electrical properties of the base material after
      complete removal of the copper foil
    7 Packaging and marking
    8 Acceptance testing
    Annex ZA (normative) Other international publications
             quoted in this standard with the references of
             the relevant European publications

    Abstract - (Show below) - (Hide below)

    Provides requirements for properties of phenolic cellulose paper copper-clad laminated sheet, economic quality, in thicknesses of 0.5 mm up to 6.4 mm.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Withdrawn

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60249-3-3:1991 Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
    IEC 60249-3-1:1981 Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
    EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
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