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    I.S. EN 60749-14:2003

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2003

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 General
    4 Test condition A - Tension
    5 Test condition B - Bending stress
    6 Test condition C - Lead fatigue
    7 Test condition D - Lead torque
    8 Test condition E - Stud torque

    Abstract - (Show below) - (Hide below)

    Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

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    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
    EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
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