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  • BS EN 60749-14:2003

    Current The latest, up-to-date edition.

    Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  15-12-2003

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 General
    4 Test condition A - Tension
    5 Test condition B - Bending stress
    6 Test condition C - Lead fatigue
    7 Test condition D - Lead torque
    8 Test condition E - Stud torque
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

    Scope - (Show below) - (Hide below)

    Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

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    Committee EPL/47
    Development Note Supersedes 02/204667 DC (12/2003) Supersedes BS EN 60749. (09/2005)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
    EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
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