IEC 60068-2-69:2017

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the method
5 Description of the test apparatus
6 Preparation of specimens
7 Materials
8 Procedure
9 Presentation of results
10 Information to be given in the relevant specification
Annex A (normative) - Equipment specification
Annex B (informative) - Use of the wetting balance for
        SMD solderability testing
Annex C (normative) - Test methods for SMD components
        sizes 0603M (0201) or smaller
Annex D (informative) - Evaluation criteria - Guidance
Annex E (informative) - Method of calculating the
        maximum theoretical force and integrated value
        of the area of the wetting curve for leaded non-SMD
Bibliography

IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.



The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.



This document provides the measurement procedures for solder alloys both with and without lead (Pb).



This edition includes the following significant technical changes with respect to the previous edition:



- integration of IEC 60068-2-54;



- inclusion of tests of printed boards;



- inclusion of new component types, and updating test parameters for the whole component list;



- inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.



The contents of the corrigendum of January 2018 have been included in this copy.