I.S. EN 60749-6:2017
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 6: STORAGE AT HIGH TEMPERATURE
Hardcopy , PDF
English
01-01-2017
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National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Summary
Bibliography
Defines the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 60749-6:2016-09 (Draft) | Identical |
| UNE-EN 60749-6:2003 | Identical |
| NBN EN 60749-6 : 2003 | Identical |
| BS EN 60749-6:2002 | Identical |
| EN 60749-6:2017 | Identical |
| NF EN 60749-6 : 2002 | Identical |
| BS EN 60749-6:2017 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
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