I.S. EN 60749-9:2017
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 9: PERMANENCE OF MARKING
Hardcopy , PDF
English
01-01-2017
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Equipment
5 Safety precautions
6 Procedure
7 Failure criteria
8 Summary
Bibliography
Defines the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.
| DevelopmentNote |
Supersedes I.S. EN 60749. NSAI reissued 2002 PDF dated 19.02.2015 with IEC Corrigenda incorporated. (06/2017)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 60749-9:2017 | Identical |
| NBN EN 60749-9 : 2003 | Identical |
| BS EN 60749-9:2002 | Identical |
| DIN EN 60749-9:2016-09 (Draft) | Identical |
| UNE-EN 60749-9:2003 | Identical |
| NF EN 60749-9 : 2002 | Identical |
| BS EN 60749-9:2017 | Identical |
| IEC 61340-2-3:2016 | Electrostatics - Part 2-3: Methods of test for determining the resistance and resistivity of solid materials used to avoid electrostatic charge accumulation |
| FED-STD-101 Revision C:1980 | TEST PROCEDURES FOR PACKAGING MATERIALS |
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