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I.S. EN 61189-3-719:2016

Current

Current

The latest, up-to-date edition.

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2016

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test specimens
5 Test apparatus
6 Procedure
7 Report
8 Additional information
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
36
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
EN 61189-3-719:2016 Identical

IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions

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