I.S. EN 61249-2-13:1999
Current
The latest, up-to-date edition.
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-13: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - CYANATE ESTER NON-WOVEN ARAMID LAMINATE OF DEFINED FLAMMABILITY, COPPER-CLAD
Hardcopy , PDF
English
01-01-1999
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
7 Non-electrical properties of the base material after
complete removal of the copper foil
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
reference numbers
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Covers requirements for properties of cyanate ester non-woven aramid copper-clad laminate of defined flammability, in thicknesses of 0.05 mm up to 6.4 mm.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 61249-2-13:1999 | Identical |
| EN 61249-2-13:1999 | Identical |
| NF EN 61249-2-13 : 2002 | Identical |
| IEC 61249-2-13:1999 | Identical |
| DIN EN 61249-2-13:1999-11 | Identical |
| UNE-EN 61249-2-13:2001 | Identical |
| EN 61249-5-1:1996 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| IEC 61249-5-1:1995 | Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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