I.S. EN 61249-3-3:1999
Current
The latest, up-to-date edition.
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-3: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS) - ADHESIVE COATED FLEXIBLE POLYESTER FILM
Hardcopy , PDF
English
01-01-1999
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Designation
6 Properties of adhesive coated polyester films
7 Dimensions and tolerances
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
reference numbers
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Provides requirements for flexible polyester (PETP) films coated on one side or both with polyester, acrylic or epoxide type adhesive for use in the fabrication of flexible printed wiring.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61249-3-3:1999 | Identical |
| SN EN 61249-3-3 : 1999 | Identical |
| EN 61249-3-3:1999 | Identical |
| NF EN 61249-3-3 : 2002 | Identical |
| BS EN 61249-3-3:1999 | Identical |
| UNE-EN 61249-3-3:2000 | Identical |
| DIN EN 61249-3-3:1999-11 | Identical |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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