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I.S. EN 61760-3:2010

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2010

Superseded date

30-03-2021

Superseded by

I.S. EN IEC 61760-3:2021

€59.00
Excluding VAT
Summarise this standard

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements to component design and component specifications
5 Specification of assembly process conditions
6 Typical process conditions
7 Requirements for components and component specifications for
  THR soldering processes
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Provides a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
28
PublisherName
National Standards Authority of Ireland
Status
Superseded
SupersededBy

Standards Relationship
IEC 61760-3:2010 Identical
EN 61760-3:2010 Identical
BS EN 61760-3:2010 Equivalent
DIN EN 61760-3:2010-12 Equivalent
UNE-EN 61760-3:2010 Equivalent

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A newer version of this standard is available.

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