I.S. EN 62047-18:2013
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS (IEC 62047-18:2013 (EQV))
Hardcopy , PDF
English
01-01-2013
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FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method
6 Test report
Annex A (informative) - Precautions for the test
piece/substrate interface
Annex B (informative) - Precautions necessary for the force
displacement relationship
Annex ZA (normative) - Normative references to international
publications with their corresponding
European publications
Describes the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 [mu]m and 10 [mu]m.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
19
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 62047-18:2013 | Identical |
| EN 62047-6:2010 | Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials |
| IEC 62047-6:2009 | Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials |
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