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I.S. EN 62047-2:2006

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2006

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Testing method and test apparatus
  4.1 Method of gripping
  4.2 Method of loading
  4.3 Speed of testing
  4.4 Force measurement
  4.5 Elongation measurement
  4.6 Stress-strain curve
  4.7 Environment control
5 Test piece
  5.1 General
  5.2 Plane shape of test piece
  5.3 Test piece thickness
  5.4 Gauge mark
6 Test report
Annex A (informative) Test piece grip methods
Annex B (normative) Testing conditions
Annex C (informative) Test piece
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Describes the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 micro meter, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
40
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
IEC 62047-2:2006 Identical
EN 62047-2:2006 Identical
NF EN 62047-2 : 2006 Identical
NBN EN 62047-2 : 2007 Identical
DIN EN 62047-2:2007-02 Identical
BS EN 62047-2:2006 Identical

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