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I.S. EN 62047-3:2006

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2006

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

€42.00
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FOREWORD
1 Scope
2 Normative references
3 Test piece materials
4 Test piece fabrications
5 Plane shape of test piece
6 Test piece thickness
7 Gauge mark
8 Test
9 Document attached to standard test pieces
Annex A (informative) Test piece
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Describes a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 micro meter, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
30
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
BS EN 62047-3:2006 Identical
NBN EN 62047-3 : 2007 Identical
NF EN 62047-3 : 2006 Identical
EN 62047-3 : 2006 Identical
DIN EN 62047-3:2007-02 Identical
IEC 62047-3:2006 Identical

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
ISO 17561:2016 Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for elastic moduli of monolithic ceramics at room temperature by sonic resonance

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