I.S. EN 62739-2:2016
Current
The latest, up-to-date edition.
TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING
Hardcopy , PDF
English
01-01-2016
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National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Erosion depth measurement
6 Items to be recorded in test report
Annex A (normative) - Specifications of test equipment
and measurement equipment
Bibliography
Annex ZA (normative) - Normative references to
international publications with their corresponding
European publications
Gives an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. Also aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
46
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 62739-2:2016 | Identical |
| IEC 62739-1:2013 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing |
| ISO 16143-3:2014 | Stainless steels for general purposes — Part 3: Wire |
| ISO 16143-2:2014 | Stainless steels for general purposes — Part 2: Corrosion-resistant semi-finished products, bars, rods and sections |
| ISO 16143-1:2014 | Stainless steels for general purposes — Part 1: Corrosion-resistant flat products |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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