I.S. EN IEC 60749-20:2020
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020)
Hardcopy , PDF
English
26-10-2020
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Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description
5 Test apparatus and materials
6 Procedure
7 Information to be given in the relevant specification.
Annex A (informative) Details and description of test method on resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).
| Committee |
TC 47
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8322-8727-9
|
| Pages |
70
|
| ProductNote |
The date of any NSAIprevious adoption may not matchthe date of its original CEN/CENELEC document
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 60749-20:2020 | Identical |
| IEC 60749-20:2020 | Identical |
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