I.S. EN IEC 60749-20:2020
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020)
Hardcopy , PDF
English
26-10-2020
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description
5 Test apparatus and materials
6 Procedure
7 Information to be given in the relevant specification.
Annex A (informative) Details and description of test method on resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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