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I.S. EN IEC 61188-6-1:2021

Current

Current

The latest, up-to-date edition.

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

28-04-2021

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Design requirements
5 Component classification
6 The proportional dimensioning system
7 Terminal classification
8 Requirements for lands of solder joints
Annex A (informative) Dimensioning concept of former IEC 61188-5-1
Annex B (informative) History of land dimensioning standards
Bibliography

This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards.

Committee
TC 91
DocumentType
Standard
ISBN
978-2-8322-9443-7
Pages
78
ProductNote
The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document. THIS STANDARD ALSO REFERS TO IPC-SM-782
PublisherName
National Standards Authority of Ireland
Status
Current
Supersedes

Standards Relationship
EN IEC 61188-6-1:2021 Identical
IEC 61188-6-1:2021 Identical

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