I.S. EN IEC 61188-6-1:2021
Current
The latest, up-to-date edition.
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
Hardcopy , PDF
English
28-04-2021
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Design requirements
5 Component classification
6 The proportional dimensioning system
7 Terminal classification
8 Requirements for lands of solder joints
Annex A (informative) Dimensioning concept of former IEC 61188-5-1
Annex B (informative) History of land dimensioning standards
Bibliography
This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-9443-7
|
| Pages |
78
|
| ProductNote |
The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document. THIS STANDARD ALSO REFERS TO IPC-SM-782
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 61188-6-1:2021 | Identical |
| IEC 61188-6-1:2021 | Identical |
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