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I.S. EN IEC 61190-1-3:2018

Current

Current

The latest, up-to-date edition.

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

10-04-2018

€64.00
Excluding VAT
Summarise this standard

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
5 Requirements
6 Quality assurance provisions
7 Preparation for delivery - Preservation, packing and packaging
Annex A (informative) - Selection of various alloys
        and fluxes for use in electronic soldering - General
        information concerning IEC 61190-1-3
Annex B (normative) - Lead-free solder alloys
Annex C (informative) - Marking method of solder
        designation for mounted board, used in
        electronic equipment
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders.

DevelopmentNote
Supersedes I.S. EN 61190-1-3. For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (04/2018)
DocumentType
Standard
Pages
0
PublisherName
National Standards Authority of Ireland
Status
Current

€64.00
Excluding VAT