I.S. EN IEC 61190-1-3:2018
Current
The latest, up-to-date edition.
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
Hardcopy , PDF
English
10-04-2018
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
5 Requirements
6 Quality assurance provisions
7 Preparation for delivery - Preservation, packing and packaging
Annex A (informative) - Selection of various alloys
and fluxes for use in electronic soldering - General
information concerning IEC 61190-1-3
Annex B (normative) - Lead-free solder alloys
Annex C (informative) - Marking method of solder
designation for mounted board, used in
electronic equipment
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for 'special' electronic grade solders.
| DevelopmentNote |
Supersedes I.S. EN 61190-1-3. For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (04/2018)
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| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
National Standards Authority of Ireland
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| Status |
Current
|
| Standards | Relationship |
| EN IEC 61190-1-3:2018 | Equivalent |
| EN IEC 61190-1-3:2018 | Identical |
| BS EN IEC 61190-1-3:2018 | Equivalent |
| DIN EN IEC 61190-1-3:2018-09 | Equivalent |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Identical |