IEC 60191-2J:1980
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
Ninth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
26-06-2024
English - French, Russian
01-01-1980
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
Preface
Chapter 00
Philosophy of Mechanical Standardization
Chapter 0
Recommended Values for Certain Dimensions of Drawings
of Semi-Conductor Devices and Integrated Microcircuits
Chapter I
Device Outline Drawings
Types of Semiconductor Devices Generally Mounted in the
Packages of Chapter I
Chapter II
Base Drawings
Chapter III
Case Outline Drawings
Chapter IV
Gauge Drawings
Chapter V
Tables Showing Associations between case Outlines and Bases
Obsolete Drawings
Additions to the Lists of National Codes Appearing on the Standard
Sheets of IEC Publication 60191-2
Incorporated into main document IEC 60191 PT2.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
This standard is part of the 1999 Consolidated edition of IEC 60191 PT2 1966 but can be purchased separately.
|
| DocumentType |
Standard
|
| Pages |
75
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| DIN 41870-6:1984-10 | Similar to |
| DIN 41870-5:1984-10 | Similar to |
| NEN 10191-2 : 1997 | Identical |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
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