IEC 60191-2U:1997
Current
The latest, up-to-date edition.
Nineteenth supplement
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
09-05-1997
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Foreword
Preface
Chapter 00
Philosophy of Mechanical Standardization
Chapter 0
Recommended Values for Certain Dimensions of Drawings of
Semiconductor Devices
Chapter I
Device Outline Drawings
Types of Semiconductor Devices Generally Mounted in the
Packages of Chapter I
Chapter II
Base Drawings
Chapter III
Case Outline Drawings
Chapter IV
Gauge Drawings
Chapter V
Tables Showing Associations Between Case Outlines and Bases
Obsolete Drawings
Additions to the Lists of National Codes Appearing on the Standard
Sheets of IEC Publication 60191-2
Deletions to the Lists of National Sheets of IEC Publication 60191-2NO CONTENTS SECTION
Incorporated into main document IEC 60191 PT2.
| DevelopmentNote |
This standard is part of the Consolidated edition of IEC 60191 PT2 1966 but can be purchased separately. Stability Date: 2020. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
11
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN IEC 60191-2U : 1998 | Identical |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
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