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  • IEC 60191-3B:1978

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  12-09-2022

    Language(s):  English - French, Russian

    Published date:  01-01-1978

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    Completes IEC 60191-3 by defining in a more satisfactory manner the mounted length and width of DIL and QUIL packages and giving recommendations for the bending of terminals of QUIL packages used for the mounting of integrated circuits.It also lists the dimensions permitting the definition of the families of packages of Form 3 and Form 4.

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    Committee TC 47/SC 47D
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
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