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  • IEC 60191-3C:1987

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Third supplement

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  12-09-2022

    Language(s):  English - French, Russian

    Published date:  15-06-1987

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    Gives the recommended dimensions of integrated circuit packages of form G family.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47D
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
    IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
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