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  • CEI 56-44 : 2000

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    DEPENDABILITY MANAGEMENT - PART 3-7: APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  01-06-2021

    Language(s):  English

    Published date:  01-01-2000

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Introduction
    1 Scope
    2 Normative references
    3 Definitions
    4 Acronyms
    5 General considerations for a reliability stress
       screening programme
    6 General information about the reliability stress
       screening process
    7 Analysis of the benefits of the reliability stress
       screening process
    8 Characteristics of a successful reliability stress
       screening programme
    9 Screening types
    10 Screening levels
    11 Screening strength
    12 Selection of screens
    13 Flaws detected by a reliability stress concerning
       process
    14 Pre-production screening process
    15 Planning, performing and eliminating a reliability
       stress screening process
    Annex A (informative) - RSS of repairable items produced
            in lots
    Annex B (informative) - RSS of electronic components

    Abstract - (Show below) - (Hide below)

    Gives a guide to reliability stress screening process for electronic hardware.

    General Product Information - (Show below) - (Hide below)

    Committee CT 56
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    CEI 56-46 : 2005 DEPENDABILITY MANAGEMENT - PART 3-5: APPLICATION GUIDE - RELIABILITY TEST CONDITIONS AND STATISTICAL TEST PRINCIPLES

    Standards Referencing This Book - (Show below) - (Hide below)

    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
    IEC 61163-1:2006 Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
    IEC 61163-2:1998 Reliability stress screening - Part 2: Electronic components
    IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
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