IEC 60317-19:1990+AMD1:1997+AMD2:1999 CSV

FOREWORD
INTRODUCTION
Clause
1 Scope
2 Normative references
3 Definitions and general notes on methods of test
4 Dimensions
5 Electrical resistance
6 Elongation
7 Springiness
8 Flexibility and adherence
9 Heat shock
10 Cut-through
11 Resistance to abrasion (nominal conductor diameters from
   0,250 mm up to and including 2,000 mm)
12 Resistance to solvents
13 Breakdown voltage
14 Continuity of insulation
15 Temperature index
16 Resistance to refrigerants
17 Solderability
18 Heat or solvent bonding
19 Dielectric dissipation factor
20 Resistance to transformer oil
21 Loss of mass
30 Packaging

IEC 60317-19:1990 specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is based on polyamide resin. NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. Class 130 is a thermal class that requires a minimum temperature index of 130 and a heat shock temperature of at least 155 °C. This second edition of IEC 60317-19 replaces the first edition issued in 1988. It has been decided to issue IEC 60182 and IEC 60317 in a new layout. The text of IEC 60182 has been incorporated into the relevant IEC 60317 without technical changes. All general requirements for enamelled round copper wires have been removed to IEC 60317-0-1 without technical changes unless stated in the foreword of IEC 60317-0-1.
This consolidated version consists of the second edition (1990), its amendment 1 (1997) and its amendment 2 (1999). Therefore, no need to order amendments in addition to this publication.