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IEC 60317-36:2013

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Specifications for particular types of winding wires - Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

21-06-2019

Language(s)

Spanish, Castilian

Published date

14-10-2013

€83.17
Excluding VAT

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions, general notes and appearance
4 Dimensions
5 Electrical resistance
6 Elongation
7 Springiness
8 Flexibility and adherence
9 Heat shock
10 Cut-through
11 Resistance to abrasion (nominal conductor
   diameters from 0,250 mm up to and including
   1,600 mm)
12 Resistance to solvents
13 Breakdown voltage
14 Continuity of insulation
15 Temperature index
16 Resistance to refrigerants
17 Solderability
18 Heat or solvent bonding
19 Dielectric dissipation factor
20 Resistance to transformer oil
21 Loss of mass
23 Pin hole test
30 Packaging
Bibliography

IEC 60317-36:2013 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyesterimide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this part is:
- Grade 1B: 0,020 mm up to and including 1,600 mm;
- Grade 2B: 0,020 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- new 3.2.2 containing general notes on winding wire, formerly a part of the scope;
- revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;
- consolidation of 17.1 and 17.2 of the solderability requirements;
- new Clause 23, Pin hole test. Keywords: requirements of solderable enamelled round copper winding wire, class 180, dual coating

Committee
TC 55
DevelopmentNote
Stability date: 2018. (10/2013)
DocumentType
Standard
Pages
36
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes
UnderRevision

12/30273916 DC : 0 BS EN 61858-1 - ELECTRICAL INSULATION SYSTEMS - THERMAL EVALUATION OF MODIFICATIONS TO AN ESTABLISHED EIS - PART-1: WIRE-WOUND WINDING EIS
BS EN 61858-1:2014 Electrical insulation systems. Thermal evaluation of modifications to an established electrical insulation system (EIS) Wire-wound winding EIS
IEC 60034-18-22:2000 Rotating electrical machines - Part 18-22: Functional evaluation of insulation systems - Test procedures for wire-wound windings - Classification of changes and insulation component substitutions
I.S. EN 61858-1:2014 ELECTRICAL INSULATION SYSTEMS - THERMAL EVALUATION OF MODIFICATIONS TO AN ESTABLISHED ELECTRICAL INSULATION SYSTEM (EIS) - PART 1: WIRE-WOUND WINDING EIS
IEC 61858-1:2014 Electrical insulation systems - Thermal evaluation of modifications to an established electrical insulation system (EIS) - Part 1: Wire-wound winding EIS
EN 61858-1:2014 Electrical insulation systems - Thermal evaluation of modifications to an established electrical insulation system (EIS) - Part 1: Wire-wound winding EIS

IEC 60317-0-1:2013 Specifications for particular types of winding wires - Part 0-1: General requirements - Enamelled round copper wire

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