IEC 60317-55:2013

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions, general notes and appearance
4 Dimensions
5 Electrical resistance
6 Elongation
7 Springiness
8 Flexibility and adherence
9 Heat shock
10 Cut-through
11 Resistance to abrasion (nominal conductor
   diameters from 0,250 mm up to and including
   1,600 mm)
12 Resistance to solvents
13 Breakdown voltage
14 Continuity of insulation
15 Temperature index
16 Resistance to refrigerants
17 Solderability
18 Heat or solvent bonding
19 Dielectric dissipation factor
20 Resistance to transformer oil
21 Loss of mass
23 Pin hole test
30 Packaging
Bibliography

IEC 60317-55:2013 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is based on polyamide resin. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is as follows:
- Grade 1: 0,020 mm up to and including 1,600 mm;
- Grade 2: 0,020 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 2007. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- revision to Clause 23, Pin hole test. Keywords: requirements of solderable enamelled round copper winding wire, class 180, dual coating

This publication is to be read in conjunction with IEC 60317-0-1:2013.