IEC 60512-16-21:2012
Current
The latest, up-to-date edition.
Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
07-05-2012
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FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test equipment
5 Preparation of the specimens
6 Measurement of whisker length
7 Test method
8 Requirements
9 Information to be recorded
10 Details to be specified
Annex A (informative) - Whisker growth due to
mechanical stresses induced by
assembly processes and intended
usage
IEC 60512-16-21:2012 The object of this standard is to define a standard test method to assess the possibility of whisker growth by external mechanical stress on the tin and tin-alloy plated parts of a connector in its application (after wire termination, after soldering, after mounting, mated with counterpart). This standard does not cover internal stress type whisker. This part of IEC 60512, when required by the detail specification, is used for testing connectors within the scope of IEC technical committee 48. It may also be used for similar devices when specified in a detail specification. Keywords: Whisker growth, external mechanical stress
| Committee |
TC 48/SC 48B
|
| DevelopmentNote |
Stability Date: 2017. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
21
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60512-16-21 : 2012 | Identical |
| NBN EN 60512-16-21 : 2012 | Identical |
| NEN EN IEC 60512-16-21 : 2012 | Identical |
| PN EN 60512-16-21 : 2013 | Identical |
| VDE 0687-512-16-21 : 2012 | Identical |
| DIN EN 60512-16-21 : 2012 | Identical |
| UNE-EN 60512-16-21:2012 | Identical |
| BS EN 60512-16-21:2012 | Identical |
| CEI EN 60512-16-21 : 2013 | Identical |
| EN 60512-16-21:2012 | Identical |
| PNE-FprEN 60512-16-21 | Identical |
| IEC 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 60512-1:2001 | Connectors for electronic equipment - Tests and measurements - Part 1: General |
| IEC 60050-581:2008 | International Electrotechnical Vocabulary (IEV) - Part 581: Electromechanical components for electronic equipment |
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