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  • IEC 60512-16-7:2008

    Current The latest, up-to-date edition.

    Connectors for electronic equipment - Tests and measurements - Part 16-7: Mechanical tests on contacts and terminations - Test 16g: Measurement of contact deformation after crimping

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  21-07-2008

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope and object
    2 Normative references
    3 Preparations
    4 Test procedure
    5 Measurements and requirements
    6 Details to be specified
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 60512-16-7:2008 details a standard test method to assess the effectiveness of contacts to resist deformation (damage) from crimping operations.

    General Product Information - (Show below) - (Hide below)

    Committee TC 48/SC 48B
    Development Note To be read in conjunction with IEC 60512-1 and IEC 60512-1-100. (07/2008) Supersedes IEC 60512-8. (05/2012) Stability Date: 2017. (10/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60512-1-1:2002 Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination
    IEC 60352-2:2006+AMD1:2013 CSV Solderless connections - Part 2: Crimped connections - Generalrequirements, test methods and practical guidance
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