IEC 60748-11:1990

FOREWORD
PREFACE
Clause
1 Scope
2 General
   2.1 Related documents
   2.2 Recommended values of temperatures
   2.3 Recommended values of voltages
   2.4 Definitions related to manufacturing operations
3 Subcontracting
4 Primary stage of manufacture
   4.1 Bipolar devices
   4.2 Unipolar devices
5 Quality assessment procedures
   5.1 Qualification approval procedures
   5.2 Capability approval procedures
6 Structural similarity procedures
   6.1 General rules
   6.2 Test dependent criteria for structural similarity
        - Table I
7 Groups and sub-groups
   Table II - Group A: Lot by lot
   Table III - Group B: Lot by lot
   Table IV - Group C: Periodic tests
   Table V - Group D
8 Screening
   Table VI - Screening
9 Sampling requirements
   Table VII - Sampling requirements for Group A tests
   Table VIII - Sampling requirements for Group B, C
   and D tests in which LTPD shall be used
10 Terminal identification
11 Additional information (under consideration)
12 Test and measurement procedures
   12.1 Electrical measuring methods
   12.2 Mechanical and climatic test methods
   12.3 Electrical endurance tests
   12.4 Accelerated test procedures
   12.5 Correlated measurements
APPENDIX A - Guidance and format for drafting blank
             detail specifications

Applies to encapsulated semiconductor integrated circuits, including multichip integrated circuits, but excluding hybrid circuits. Gives details of the Quality Assessment Procedures, the inspection requirements, screening sequences, sampling requirements, test and measurement procedures required for the assessment of semiconductor integrated circuits, including digital, analogue and interface circuits.