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IEC 60748-22:1997

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

10-04-1997

€358.68
Excluding VAT

FOREWORD
1 Scope and object
2 General preferred characteristics, ratings and
    severities for environmental tests
    2.1 Normative references
    2.2 Preferred ratings and characteristics
    2.3 Information to be given in a detail specification
3 Capability approval procedures
    3.1 Selection of capability qualifying circuits
          (CQCs)
    3.2 Structural similarity
    3.3 Capability approval
    3.4 Resubmission of rejected lots (lot-by-lot
          inspection)
    3.5 Manufacturing stages in a factory of an approved
          manufacturer
4 Test and measurement procedures
5 Tables for method B
Annexes
A Structural similarity rules for capability approval
B Minimum contents of a manufacturer's capability manual
    for thick film circuits
C Minimum contents of a manufacturer's capability manual
    for thin film circuits
Tables
1 Test schedule for capability approval for method A
2 Assessment levels and acceptance criteria for capability
    manual for thick film circuits
3 Assessment levels and acceptance criteria for quality
    conformance inspection for method A
4 Screening
5 Test schedule for capability approval for method B
6 Assessment levels and acceptance criteria for
    capability approval for method B
7 Assessment levels and acceptance criteria for quality
    conformance inspection for method B

Applies to film and hybrid film integrated circuits (F and HICs),manufactured as catalogue or as custom-built circuits whosequality is assessed on the basis of the capability approvalprocedure. Presents preferred values for ratings andcharacteristics, selects from the generic specificationthe appropriate tests and measuring methods and gives generalperformance requirements to be used in detailspecifications for film and hybrid film integrated circuits.

Committee
TC 47/SC 47A
DevelopmentNote
Also numbered as BS QC760200(1997). (09/2003) Supersedes IEC 60186B. (07/2004) Stability Date: 2020. (09/2017)
DocumentType
Standard
Pages
121
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

Standards Relationship
NEN IEC 60748-22 : 1998 Identical

BS QC 760201:1992 Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification. Film and hybrid integrated circuits: capability approval
BS QC 760201:1997 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60748-21:1991 Semiconductor devices. Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedure.
IEC TR 60440:1973 Method of measurement of non-linearity in resistors
IEC 60063:2015 Preferred number series for resistors and capacitors
IEC 60748-20-1:1994 Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination

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